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Package Substrate Division successfully held the tug-of-war competition with the theme of "Competing for Success"
07 14,2021 发布者：admin 73

On May 17, in order to enrich the employees' spare time, the Package Substrate Division of Shennan Circuits organized a tug-of-war competition with the theme of "Competing for Success" for the Shenzhen staff, and 26 teams from different operations participated in the competition.

After two weeks of intense competition, the Power Combo Team from the Shenzhen No.1 Factory won the championship.In the competition, all teams practiced the spirit of friendship first and competition second, and enhanced team cohesion.