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Company introduction Management system Development history Shennan honor Home of hearts and chips Social responsibilities Join Us Contact Us
High Speed and High Capacity RF and Microwave Thermal Management Miniaturization Chip package substrate One-stop service
Innovation platform Innovation achievement PCB PCBA SUB SIP
Periodic report Interim notice Prospectus supplement Corporate governance Shareholder return
Concepts of social responsibilities Governing body Sustainable development goals System authentication Environmental protection information disclosure Declaration of non use of conflict metal Product hazardous substance test report Specification of supply chain management Statement of business ethics CSR Report
Talent Strategies Social recruitment Campus recruitment Internship Hiring Salary, welfare and office environment
2023 Shennan Circuits Sustainability (and ESG) Report 2022 Shennan Circuits Sustainability (and ESG) Report 2021 Shennan Circuits Sustainable Development Report 2020 Shennan Circuits Sustainable Development Report 2019 Shennan Circuits Sustainable Development Report 2018 Shennan Circuits Sustainable Development Report 2017 Shennan Circuits Sustainable Development Report 2017 Shennan Circuits Sustainable Development Report 2016 Shennan Circuits Sustainable Development Report 2015 Shennan Circuits Sustainable Development Report
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