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Company introduction Management system Development history Shennan honor Home of hearts and chips Social responsibilities Join Us Contact Us
High Speed and High Capacity RF and Microwave Thermal Management Miniaturization Chip package substrate One-stop service
Innovation platform Innovation achievement PCB PCBA SUB SIP
Periodic report Interim notice Prospectus supplement Corporate governance Shareholder return
Concepts of social responsibilities Governing body Sustainable development goals System authentication Environmental protection information disclosure Declaration of non use of conflict metal Product hazardous substance test report Specification of supply chain management Statement of business ethics CSR Report
Talent Strategies Social recruitment Campus recruitment Internship Hiring Salary, welfare and office environment
periodic report interim report Prospectus

Shennan circuit announcement includes: regular report (including annual report, semi annual report, quarterly report), temporary announcement, etc. The company shall disclose information in accordance with the law and promise that the report content is true and reliable.