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Company introduction Management system Development history Shennan honor Home of hearts and chips Social responsibilities Join Us Contact Us
High Speed and High Capacity RF and Microwave Thermal Management Miniaturization Chip package substrate One-stop service
Innovation platform Innovation achievement PCB PCBA SUB SIP
Periodic report Interim notice Prospectus supplement Corporate governance Shareholder return
Concepts of social responsibilities Governing body Sustainable development goals System authentication Environmental protection information disclosure Declaration of non use of conflict metal Product hazardous substance test report Specification of supply chain management Statement of business ethics CSR Report
Talent Strategies Social recruitment Campus recruitment Internship Hiring Salary, welfare and office environment
SCC NT_Gold plating PCB_RoHS 2.0 Report_20250403 SCC NT_Immersion Tin PCB_RoHS 2.0 Report_20250403 SCC NT_Lead free HASL PCB_RoHS 2.0 Report_20250403 SCC NT_OSP PCB_RoHS 2.0 Report_20250403 SCC NT_Immersion Ag PCB_RoHS 2.0 Report_20250403 SCC NT_ENIG PCB_RoHS 2.0 Report_20250403 SCC WX_Rigid-flexible PCB_RoHS 2.0 Report_20250403 SCC WX_Halogen free PCB Report_20250403 SCC WX_Gold plating PCB_RoHS 2.0 Report_20250403 SCC WX_ENEPIG PCB_RoHS 2.0 Report_20250403
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