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Company introduction Management system Development history Shennan honor Home of hearts and chips Social responsibilities Join Us Contact Us
High Speed and High Capacity RF and Microwave Thermal Management Miniaturization Chip package substrate One-stop service
Innovation platform Innovation achievement PCB PCBA SUB SIP
Periodic report Interim notice Prospectus supplement Corporate governance Shareholder return
Concepts of social responsibilities Governing body Sustainable development goals System authentication Environmental protection information disclosure Declaration of non use of conflict metal Product hazardous substance test report Specification of supply chain management Statement of business ethics CSR Report
Talent Strategies Social recruitment Campus recruitment Internship Hiring Salary, welfare and office environment
Solutions

High Speed and High Capacity

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RF and Microwave

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Thermal Management

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Miniaturization

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Chip package substrate

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One-stop service

From the perspective of electronic industry chain, Shennan circuit as a whole has the production and service capacity from level 1 packaging to level 3 complete machine assembly, and can create more value for customers through one-stop service. Read more >