On March 16, after a strict review by a number of experts in the industry, SCC project of "motherboard applicable to next generation of large-capacity wireless communication backbone network" successfully passed the appraisal of scientific and technological achievement.

With the rapid development of the communication industry, especially the popularization of Internet of Things and the application of new technologies such as cloud computing, the data size of network transmission increases at the geometric level, which requires the communication equipment to process larger and larger size of data, while the size of the motherboard capacity directly affects the transmission capacity of key transmission devices such as switchboard. Responding to the demand for large-capacity motherboard, SCC set up a special team to conduct research on the key technology of large-capacity motherboard, and developed and optimized the technology for mass production of large-capacity motherboards. Thus, SCC independently developed the manufacturing technology of the "motherboard applicable to next generation of large-capacity wireless communication backbone network", and had the capacity for mass production of large-capacity motherboards with stable quality.

 After appraised by the industry experts, the Project has made a number of innovations; its overall technology is domestically leading and international advanced, and can provide support for next generation of communication products; and it has a broad market. In the course of project development, SCC applied for 11 related patents, including 10 invention patents.

　　The successful research and development of the Project represents that SCC's technology in motherboard has once again reached a new level, which is conducive to transform the customer's network transmission equipment into the world's leading product. Up to now, six projects of SCC have passed the appraisal of scientific and technological achievement.