On March 19th, the scientific and technological achievement appraisal conference of SCC “High-speed Printed Circuit Board for Transmission of Over 100G Backbone Network” and “High-end IC Test Printed Circuit Board” projects was held in Shanghai World Expo Exhibition Hall.

　　At the conference, the members of the appraisal committee heard the technical summary report of the projects, and reviewed the inspection report, novelty search report and other materials and products on the scene. After careful discussion, the appraisal committee agreed that the two products of SCC showed stable reliability, not only had technical innovation, but also had broad market prospects, and the overall level was in the leading position in China, filling in the domestic industry technology gaps and even reaching the international advanced level. Finally, the seven experts on the scene agreed that SCC's "High-speed Printed Circuit Board for Transmission of Over 100G Backbone Network” and “High-end IC Test Printed Circuit Board” projects passed the scientific and technological achievement appraisal.