About Shennan

News Information

Solutions

Product Technology

Investor Relations

Social responsibilities

Join Us

Company introduction Management system Development history Shennan honor Home of hearts and chips Social responsibilities Join Us Contact Us
High Speed and High Capacity RF and Microwave Thermal Management Miniaturization Chip package substrate One-stop service
Innovation platform Innovation achievement PCB PCBA SUB SIP
Periodic report Interim notice Prospectus supplement Corporate governance Shareholder return
Concepts of social responsibilities Governing body Sustainable development goals System authentication Environmental protection information disclosure Declaration of non use of conflict metal Product hazardous substance test report Specification of supply chain management Statement of business ethics CSR Report
Talent Strategies Social recruitment Campus recruitment Internship Hiring Salary, welfare and office environment
SCC Holds "Smart Interconnection" Seminar on Innovative Technology Solutions for Electronic Circuits
07 28,2014 发布者：admin 64

　　On July 4th, the SCC "Smart Interconnection" Seminar on Innovative Technology Solutions for Electronic Circuits was held in the Coli Hotel Shenzhen. More than 100 SCC partners were invited to attend the seminar and jointly discussed the R&D and development trends in the field of electronic circuit technology.


　　Compared with previous technical seminars, this seminar carried out many innovations. In addition to lectures and discussions, the seminar offered all-directional, three-dimensional display of SCC technologies and products in the form of text, physical objects and projected dynamic image materials; the seminar also invited a number of internationally renowned scholars, technical experts and industry authorities to give thematic presentations.