On October 21-23, the 8th China International Semiconductor Expo & Summit (IC China 2010) was held in Suzhou International Expo Center. SCC first ever participated in the Expo in the capacity of an exhibitor of semiconductor equipment materials.

The theme of this Exposition is cooperation innovation, integrated improvement and sustained development. As the construction unit of IC packaging substrate project -- No. 02 special project of major national science and technology projects, on the basis of displaying traditional high-end circuit board products, SCC focused on displaying the latest development of IC packaging substrate products, highlighting its advantage of one-stop service, from PCB and substrate design to production, and then to PCBA mounting. SCC made careful planning and preparation in terms of booth design, selection of exhibits, and publicity model, was granted the best booth creative design and set-up award by the organizer of the Expos, and won the unanimous praise from customers and peers. On the first day of the Expo, Yang Xueshan, Vice Minister of the Ministry of Industry and Information Technology of China, visited the booth of SCC, learned the operation situation of SCC products and packaging substrate projects, and highly appraised the contribution made by SCCto the development of national semiconductor industry. During the three-day Expo, a constant stream of customer visited the booth of SCC and negotiated cooperation with SCC.

　　IC China is an annual event in the international semiconductor industry; it has been successfully held for seven sessions. This Expo was organized by China Semiconductor Industry Association, CCPIT Electronic Information Industry Branch and the People's Government of Suzhou City. More than 200 enterprises were attracted to participate in the exhibition, covering all upstream and downstream sectors of the semiconductor industry. Domestic and foreign well-known semiconductor enterprises sent strong work teams to participate in the exhibition.