About Shennan

News Information

Solutions

Product Technology

Investor Relations

Social responsibilities

Join Us

Company introduction Management system Development history Shennan honor Home of hearts and chips Social responsibilities Join Us Contact Us
High Speed and High Capacity RF and Microwave Thermal Management Miniaturization Chip package substrate One-stop service
Innovation platform Innovation achievement PCB PCBA SUB SIP
Periodic report Interim notice Prospectus supplement Corporate governance Shareholder return
Concepts of social responsibilities Governing body Sustainable development goals System authentication Environmental protection information disclosure Declaration of non use of conflict metal Product hazardous substance test report Specification of supply chain management Statement of business ethics CSR Report
Talent Strategies Social recruitment Campus recruitment Internship Hiring Salary, welfare and office environment
SCC attended the 15th China Semiconductor Expo. and Summit Forum
10 25,2017 发布者：admin 162

IC CHINA 2017 (the 15th China Semiconductor Expo. cum Summit Forum) kicked off in Shanghai's New International Expo Center on October 25, 2017, and the representatives of SCC' substrate and Tianxin interconnection business attended.

 

　　The three days of exhibition gathered multiple heavyweights in the industry. At the ingeniously designed booth, SCC's substrate, SiP packaging, test boards and other exemplary products were well arranged, which fully  displayed the company's image of an advanced electronic manufacturing enterprise which shows its circuit substrate and Tianxin interconnection is based on the design and manufacture of the high-end substrate and the SIP packaging, and attracted the attentions of multiple guests and exhibitors. Accompanied by Mr. Kong Lingwen, SCC's Chief Engineer and General Manager of Wuxi Tianxin Interconnection Technology Co., Ltd., Mr. Diao Shijing, Director of the Ministry of Industry and Information Technology, Mr. Bi Keyun, Secretary-General of China Semiconductor Industry Association and Mr. Ding Wenwu, President of China Integrated Circuit Industry Investment Fund Co., Ltd. came to SCC's exhibition booth, had a good understanding of the company's displayed products and spoke highly of its development. Shennan's exhibition staff introduced and promoted the company's latest products and technical routes to the key customers, suppliers, leading enterprises at the upstream and downstream of the industrial chain, which was substantially fruitful.


11.JPG