Features :

● 2~6 layers

● Package type : FC

● Typic Line Width/Space : 12/12μm-25μm/25μm

Applications:

High end AP packaging ( Applied in smart phone, PC, and Multimedia equipment, etc). 

Features :

● 2~6 layers

● Package type : WB

● Package Size: 3*3mm - 23*23mm

● Thickness : 0.11mm-0.56mm

● Typic Line Width/Space : 25/25μm-40μm/40μm

Applications: AP packaging (Applied in mobile phone, PC, and Multimedia equipment, etc).

Features :

● 2,3,4 layers 

● Typical BF Pitch：70-90μm

● Strict Solder resist Flatness

Surface finish：电金+OSP 

Applications:

eMMC or eMCP memory IC packaging( Applied in smart phone, PC, and server etc).

Features : 

● 2~4 layers

● Board thickness：130um

● Typic BF Width/Space : 75μm~100μm

● Printing ink type：Black oil

● Surface finish：Hard gold，Electroplated Soft Gold

Applications:

Memory module packaging ( Applied in Navigation, Digital Camera, PDA, Laptop ).

Features :

● 2~8 Layer 

● Surface finish: Ni/Au( Bussless), ENEPIG, OSP.

● Tighten pattern dimension and thickness conformity

● Tighten layer registration control 

Applications: 

RF module  packaging （Applied in Smart phones ,wearable devices and IOT application  and PC, etc）.

Features :

● 2Layer

● Thin board： 100μm or 130μm

● Fine pitch pattern

● Surface finish: Ni/Au( Bussless), ENEPIG, OSP. 

● Strict Warpage control ≤0.9mm

Applications: 

MEMS-sensor  Module  packaging (Applied in Smart phone, wearable device, Automotive, Medical instrument)

Features :

● 2,4,6Layer

● Embedded Capacitor and Resistor

Applications: 

MEMS-microphone module  packaging （Applied in smart phone，intelligent sound box, wearable device and PC etc）.