Technical ability
Mechanical Blind holes Backplane
100 layers dobolue-side Crimping Backplane
Multifunctional integrated Copper Combined board
ODU RF Board
E-band ODU RF Board
BMS FPC Board
FPC Of car`s camera
RF Board for for automotive collision avoidance radar
FPC for camera
| Items | Mass | Sample | |
| Layers | 2~68L | 120L | |
| Max. Board Thickness | 10mm（394mil） | 14mm（551mil） | |
| Min. Width | Inner Layer | 2.2mil/2.2mil | 2.0mil/2.0mil |
| Outer Layer | 2.5/2.5mil | 2.2/2.2mil | |
| Registration | Same Core | ±25um | ±20um |
| Layer to Layer | ±5mil | ±4mil | |
| Max. Copper Thickness | 6Oz | 30Oz | |
| Min. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1mm（4mil） | 0.050mm（2mil） | |
| Max. Size (Finish Size) | Line-card | 850mmX570mm | 1000mmX600mm |
| Backplane | 1250mmX570mm | 1320mmX600mm | |
| Aspect Ratio (Finish Hole) | Line-card | 20:1 | 28:1 |
| Backplane | 25:1 | 35:1 | |
| Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
| Surface Finish | HASK, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP，ENEPIG | ||
Layer Count: 68
Board Thickness: 9.5mm
Panel Size: 1370x530mm (54”×21” )
Finished Hole Size: 0.46mm
Aspect Ratio: 20.7:1
Material: Nelco N4000-13EP SI
Application: Data telecom
Layer count:100
Board Thickness: 14mm
Panel Size: 438mm x 850mm
Minimum Hole Size:0.34mm
Aspect Ratio: 24.7:1
Material:M7N
Application: backbonetransmission network
Layer count :12
Board Thickness: 2.6mm
Copper Thickness:1oz
Material: Rogers4350B+FR4
Type: Metal based power amplifier board
Application: Wireless communication base station
Layer count : 10
Board Thickness: 2.0mm
Copper Thickness:1oz
Material: RO4350+FR4
Application: Micro-wave
Layer count : 4
Board thickness:0.7mm
Copper thickness : 1oz
Material : RO4350+FR4
Application: Micro-wave
Layer count :1
Board thickness : 0.28mm
Material : Copper + coverlay
Type : BMS lug collection board
Application : Car
Layer count: 6
Board thickness :1.55mm
Copper thickness : 1oz
Material: MCE-G-700G
Application: Vehicular HD camera
Feature: Rigid-flex
Layer count :8
Board thickness : 1.2mm
Copper thickness :1oz
Material : Ro3000+IT180A
Type : 77GHz Millimeter wave radar
Application : automotive collision avoidance radar
Layer count : 6
Board thickness : 0.9mm
Copper thickness :1 oz
Material: IT180A + AK
Application: Vehicular HD camera
Feature: Rigid-flex
Technical ability
Mechanical Blind holes Backplane
100 layers dobolue-side Crimping Backplane
Multifunctional integrated Copper Combined board
ODU RF Board
E-band ODU RF Board
BMS FPC Board
FPC Of car`s camera
RF Board for for automotive collision avoidance radar
FPC for camera
| Items | Mass | Sample | |
| Layers | 2~68L | 120L | |
| Max. Board Thickness | 10mm（394mil） | 14mm（551mil） | |
| Min. Width | Inner Layer | 2.2mil/2.2mil | 2.0mil/2.0mil |
| Outer Layer | 2.5/2.5mil | 2.2/2.2mil | |
| Registration | Same Core | ±25um | ±20um |
| Layer to Layer | ±5mil | ±4mil | |
| Max. Copper Thickness | 6Oz | 30Oz | |
| Min. Drill Hole Dlameter | Mechanical | ≥0.15mm(6mil) | ≥0.1mm(4mil) |
| Laser | 0.1mm（4mil） | 0.050mm（2mil） | |
| Max. Size (Finish Size) | Line-card | 850mmX570mm | 1000mmX600mm |
| Backplane | 1250mmX570mm | 1320mmX600mm | |
| Aspect Ratio (Finish Hole) | Line-card | 20:1 | 28:1 |
| Backplane | 25:1 | 35:1 | |
| Material | FR4 | EM827, 370HR, S1000-2, IT180A, EM825, IT158, S1000 / S1155, R1566W, EM285, TU862HF | |
| High Speed | Megtron6, Megtron4, Megtron7,TU872SLK, FR408HR,N4000-13 Series,MW4000,MW2000,TU933 | ||
| High Frequency | Ro3003, Ro3006, Ro4350B, Ro4360G2, Ro4835, CLTE, Genclad, RF35, FastRise27 | ||
| Others | Polyimide, Tk, LCP, BT, C-ply, Fradflex, Omega , ZBC2000, | ||
| Surface Finish | HASK, ENIG, Immersion Tin, OSP, Immersion Silve, Gold Finger, Electroplating Hard Gold/Soft Gold, Selective OSP，ENEPIG | ||
Layer Count: 68
Board Thickness: 9.5mm
Panel Size: 1370x530mm (54”×21” )
Finished Hole Size: 0.46mm
Aspect Ratio: 20.7:1
Material: Nelco N4000-13EP SI
Application: Data telecom
Layer count:100
Board Thickness: 14mm
Panel Size: 438mm x 850mm
Minimum Hole Size:0.34mm
Aspect Ratio: 24.7:1
Material:M7N
Application: backbonetransmission network
Layer count :12
Board Thickness: 2.6mm
Copper Thickness:1oz
Material: Rogers4350B+FR4
Type: Metal based power amplifier board
Application: Wireless communication base station
Layer count : 10
Board Thickness: 2.0mm
Copper Thickness:1oz
Material: RO4350+FR4
Application: Micro-wave
Layer count : 4
Board thickness:0.7mm
Copper thickness : 1oz
Material : RO4350+FR4
Application: Micro-wave
Layer count :1
Board thickness : 0.28mm
Material : Copper + coverlay
Type : BMS lug collection board
Application : Car
Layer count: 6
Board thickness :1.55mm
Copper thickness : 1oz
Material: MCE-G-700G
Application: Vehicular HD camera
Feature: Rigid-flex
Layer count :8
Board thickness : 1.2mm
Copper thickness :1oz
Material : Ro3000+IT180A
Type : 77GHz Millimeter wave radar
Application : automotive collision avoidance radar
Layer count : 6
Board thickness : 0.9mm
Copper thickness :1 oz
Material: IT180A + AK
Application: Vehicular HD camera
Feature: Rigid-flex
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